/// <summary>
/// 带参数的启动
/// </summary>
/// <param name="PosPut">放晶位置</param>
public void Start(FPointXYZR PosPut, FPointXY PosCheck)
{
if (LG.Execute == false && LG.Step == 0)
{
this.Pos_Put = PosPut;
this.Pos_Check = PosCheck;
Start();
}
}
/// <summary>
/// 带参数的启动
/// </summary>
/// <param name="p">跳跃目标位置</param>
/// <param name="CheckVacuo">在跳跃到目标位置上方时，检测真空</param>
/// <param name="PreInpZ">Z轴提前量，平滑处理</param>
/// <param name="PreInpY">Y轴提前量，平滑处理</param>
public void Start(FPointXYZR p, bool CheckVacuo = false, float PreInpZ = 0, float PreInpY = 0)
{
if (LG.Execute == false && LG.Step == 0)
{
this.CheckVacuo = CheckVacuo;
this.PreInpY = PreInpY;
this.PreInpZ = PreInpZ;
this.PosTar = p;
Start();
}
}
protected override void LogicImpl()
{
switch (LG.Step)
{
case 1:
FPointXYZR p = TaskMain.PickTake.Pos_Take.Clone(); //取晶位置，clone出来
p.Z = TaskMain.PickJump.Ready.Z; //Z位置改成预备高度
TaskMain.PickJump.Start(p); //跳跃到取晶位上方
LG.StepNext(2);
break;
case 2:
if (TaskMain.PickJump.GetSta() == 0) //等待定位结束
{
DeviceRsDef.Ax_PickZ.MC_MoveAbs(0, Pos_DetectMax); //以最慢速度向测高极限移动
LG.StepNext(3);
}
break;
case 3:
if (DeviceRsDef.Ax_PickZ.busy) //在轴运行过程中
{
if (DeviceRsDef.I_PickDetect.value) //检测到测高信号
{
TaskMain.PickTake.Pos_Take.Z = DeviceRsDef.Ax_PickZ.currPos; //更新取晶高度
DeviceRsDef.Ax_PickZ.MC_Stop(); //停止轴
LG.StepNext(4); //
}
}
else //测高轴运行结束
{
MessageBox.Show("测高失败，到达测高极限", "提示");
LG.End();
}
break;
case 4:
if (!DeviceRsDef.Ax_PickZ.busy)
{
MessageBox.Show("测高完成，取晶高度已更新", "提示");
LG.End();
}
break;
}
}
public PickTakeDef() : base("拾取取晶")
{
Pos_Take = new FPointXYZR();
}
public bool VacuoResult; //真空检测结果
public PickJumpDef() : base("拾取跳跃")
{
Ready = new FPointXYZR();
}
public PickDiscardDef() : base("拾取弃料")
{
Pos_Discard = new FPointXYZR();
}
protected override void LogicImpl()
{
//放晶时循环处理提前控制真空和吹气
if (LG.Execute == true)
{
if (Tr.TrigOne(System.Math.Abs(DeviceRsDef.Ax_PickZ.currPos - Pos_Put.Z) <= Pos_Ahead, 0)) //当Z位置进入到提前范围内时，执行一次
{
DeviceRsDef.Q_PickVacuo.OFF(); //关真空
DeviceRsDef.Q_PickBlow.ON(); //开吹气
}
}
switch (LG.Step)
{
case 1:
if (!DeviceRsDef.Q_PickVacuo.Value || !DeviceRsDef.I_PickVacuo.value) //如果没取好片
{
TaskMain.PickTake.Start(); //执行取片
}
LG.StepNext(2);
break;
case 2:
if (DeviceRsDef.Q_PickVacuo.Value && DeviceRsDef.I_PickVacuo.value) //如果取好片了
{
FPointXYZR p = Pos_Put.Clone(); //取放晶点位置
p.Z = Pos_Put.Z - Pos_Slow; //Z修改为慢速点
TaskMain.PickJump.Start(p, true, TaskMain.PickJump.Pos_PreInpZ); //跳跃到放晶点的慢速高度，检测真空，Z带提前量
LG.StepNext(3);
}
else //如果没取好片
{
LG.End(); //结束流程
}
break;
case 3:
if (TaskMain.PickJump.GetSta() == 0) //跳跃结束
{
if (TaskMain.PickJump.VacuoResult) //真空检测OK
{
DeviceRsDef.Ax_PickZ.MC_MoveAbs(Spd_Slow, Pos_Put.Z); //Z慢速到放晶位
LG.StepNext(4);
}
else //真空异常
{
//要报警
PutOk = false; //标志放晶失败
LG.End();
}
}
break;
case 4:
if (!DeviceRsDef.Ax_PickZ.busy) //等待Z到位
{
//DeviceRsDef.Q_PickVacuo.OFF();//由提前量控制吹气和真空
//DeviceRsDef.Q_PickBlow.ON();
Tm.Restart(); //到位开始计时
LG.StepNext(5);
}
break;
case 5:
if (Tm.ElapsedMilliseconds >= Tim_Put) //放晶时间到
{
DeviceRsDef.Q_PickBlow.OFF(); //关闭吹气
TaskMain.PickTake.Start(); //取晶
TaskMain.TrayDesk.Start(Pos_Check); //相机移动到该点
LG.StepNext(6);
}
break;
case 6:
if (TaskMain.TrayDesk.GetSta() == 0 && DeviceRsDef.Ax_PickY.currPos < TaskMain.PickJump.Ready.Y + 1)
{
VisionSot = true; //触发视觉
LG.StepNext(7);
}
break;
case 7:
if (!VisionSot) //等待视觉结束
{
PutOk = VisionRet; //标志放晶结果
LG.End();
}
break;
}
}
